Technology / Technology capabilities

Technology capabilities

Specification table

Our rich knowledge and modern production line enable a diverse selection of solutions. Take a look at our production facilities in the table below and choose what suits you.

Single Sided Printed Circuit Boards

CCL TypeCEM1, CEM3, CEM3Thermal, FR4
Thicknessfrom 0,5 mm to 3,5 mm
Copperstandard 35 μm (option 17/70 μm)
Optimal production panel size405 mm x 533 mm and 533 mm x 608 mm
Max panel size1200 mm x 533 mm or 1000 mm x 600 mm

Etch resist

FINE standardSTANDARD mass production
Min Track0,07 mm0,25 mm
Track to Track0,07 mm0,25 mm
Track to Pad0,10 mm0,40 mm
Drill to Pad0,20 mm0,35 mm
Min Pad0,10 mm0,30 mm
Cu to Border (V-Cut)0,35 mm0,35 mm
Cu to Border (routing)0,20 mm0,20 mm

Standard solder masks

High reflective whiteScreen print process
Cold whiteExposure process and screen print process
Warm whiteExposure process and screen print process
Black, GreenExposure process and screen print process
LEGEND PRINT
Black, white, greyScreen print process

CNC Machining

DRILLINGROUTING
min hole 0,40 mmmin routing slot 0,80 mm
V-cut SCORING
Asymetric scoring possiblejump score OK
PUNCHING MASS PRODUCTION only
Push out or Push back
min hole diameter 0,90 mm
min Slot punching 1,10 mm

Inspection

Bed of nails grid e-testing100 % Automatic optical inspection (AOI)Flying probe e-testing

FINAL COATING

HAL Lead free, ENIG, CHEM TIN
Organic Solder Passivation (OSP)

Insulated Metal Substrate (IMS) Printed Circuit Boards

CCL TypeIMS 2W/mK, 3W/mK, 5W/mK, 9W/mK
Thicknessstandard 1,50mm (min 0,50 mm to max 3,50 mm)
Dialectricstandard 150 μm, Breakdown (5kV AC) (6kV DC)
Copperstandard 35 μm (option 70 μm/105 μm/210 μm)
Optimal production panel size405 mm x 533 mm or 533 mm x 608 mm
Max production panel size1200 mm x 533 mm or 1000 mm x 600 mm

Etch resist

Fine standard 35 μmSTANDARD 35 μm mass production
Min Track0,07 mm0,25 mm
Track to Track0,07 mm0,25 mm
Track to Pad0,10 mm0,40 mm
Drill to Pad0,20 mm0,35 mm
Min Pad0,10 mm0,30 mm
Cu to Border (V-Cut)0,35 mm0,35 mm
Cu to Border (routing)0,20 mm0,20 mm

Standard solder masks

High reflective whiteScreen print process
Cold whiteExposure process and screen print process
Warm whiteExposure process and screen print process
Black, GreenExposure process and screen print process
LEGEND PRINT
Black, white, greyScreen print process

CNC Machining

DRILLINGROUTING
min hole 0,40 mmmin routing slot 0,80 mm
V-cut SCORING
Asymetric scoring possiblejump score OK
PUNCHING MASS PRODUCTION only
Push out
min hole diameter 0,90 mm
min Slot punching 1,10 mm

Inspection

Bed of nails grid e-testing100 % Automatic optical inspection (AOI)Flying probe e-testing

FINAL COATING

HAL Lead free
Organic Solder Passivation (OSP)

Heavy Copper Printed Circuit Boards

CCL TypeFR4, IMS
Thicknessfrom 1,0 mm to 3,5 mm
Copperup to 210 μm
Standard production panel size405 mm x 533 mm or 533 mm x 608 mm

Etch resist

STANDARD mass production
Min Track0,40 mm
Track to Track0,50 mm
Track to Pad0,70 mm
Drill to Pad0,50 mm
Min Pad0,40 mm
Cu to Border (V-Cut)0,60 mm
Cu to Border (routing)0,40 mm

Standard solder masks

High reflective whiteScreen print process
Cold whiteExposure process and screen print process
Warm whiteExposure process and screen print process
Black, GreenExposure process and screen print process
LEGEND PRINT
Black, white, greyScreen print process

CNC Machining

DRILLINGROUTING
min hole 0,40 mmmin routing slot 0,80 mm
V-cut SCORING
Asymetric scoring possiblejump score OK
PUNCHING MASS PRODUCTION only
Push out
min hole diameter 0,90 mm
min Slot punching 1,10 mm

Inspection

Bed of nails grid e-testingFlying probe e-testing

FINAL COATING

HAL Lead free, ENIG, CHEM TIN
Organic Solder Passivation (OSP)

XLarge format Printed Circuit Boards

CCL TypeCEM1, CEM3, CEM3Thermal, FR4, IMS
Thicknessstandard 1,50mm (from 0,5 mm to 3,5 mm option)
Copper35 μm standard (17/70 μm option)
Max production panel size1200 mm x 533 mm or 1000 mm x 600 mm

Etch resist

STANDARD
Min Track0,25 mm
Track to Track0,25 mm
Track to Pad0,40 mm
Drill to Pad0,35 mm
Min Pad0,30 mm
Cu to Border (V-Cut)0,35 mm
Cu to Border (routing)0,20 mm

Standard solder masks

High reflective whiteScreen print process
Cold white Screen print process
Warm white Screen print process
Black, GreenScreen print process
LEGEND PRINT
Black, white, greyScreen print process

CNC Machining

DRILLINGROUTING
min hole 0,40 mmmin routing slot 0,80 mm
V-cut SCORING ok

Inspection

100 % Automatic optical inspection (AOI)

FINAL COATING

Organic Solder Passivation (OSP)

Bandable IMS Printed Circuit Boards

CCL TypeIMS 0.8~0.9 W/m’C (ASTM E1461)
Thicknessstandard 0,5 mm to 1,50 mm
DialectricKapton
Copper35 μm
Optimal production panel size400 mm x 500 mm or 500 mm x 600 mm

Etch resist

Fine standardSTANDARD mass production
Min Track0,07 mm0,25 mm
Track to Track0,07 mm0,25 mm
Track to Pad0,10 mm0,40 mm
Drill to Pad0,20 mm0,35 mm
Min Pad0,10 mm0,30 mm
Cu to Border (V-Cut)0,35 mm0,35 mm
Cu to Border (routing)0,20 mm0,20 mm

Standard solder masks

High reflective white flexExposure process
LEGEND PRINT
Black, white, greyScreen print process

CNC Machining

DRILLINGmin hole 0,40 mm
ROUTINGprototypes only
V-cut SCORING
Asymetric scoring possiblejump score OK
PUNCHING MASS PRODUCTION
Push out
min hole diameter 0,90 mm
min Slot punching 1,10 mm

Inspection

Bed of nails grid e-testing100 % Automatic optical inspection (AOI)Flying probe e-testing

FINAL COATING

HAL Lead free
Organic Solder Passivation (OSP)

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