Proizvodni program
- Enostranska tiskana vezja
- IMS tiskana vezja s kovinsko osnovo
- STH dvostranska tiskana vezja s polnimi vijami prevodne paste
- Tiskana vezja s srebrnimi ali karbonskimi prevezmi
- Tiskana vezja s karbonskimi kontakti ali karbonskim uporovnim tiskom
- Izdelava spajkalnih mask za selektivno spajkanje
- Orodjarna
Certifikati:
Tiskana vezja s srebrnimi ali karbonskimi prevezmi
MATERIAL
Type
CEM1 (standard), CEM3, FR4, FR2
Thickness
from 1,0mm 1,55mm
Copper
35 Micron (standard)
Carbon resistance
10 Ohm/sq/25 (standard)
Silver resistance
below 1 Ohm/sq/25
Printed carbon thickness
from 10 micron
Printed silver thickness
from 10 micron
CNC MACHINING
Drilling
min hole 0,40mm
Routing
min routing slot 0,80mm
V-cut
max material thickness 3,50mm
MASS PRODUCTION
Punching
Push out or Push back
min hole 0,9mm
0,9mm
Min Slot punching
0,9mm
Min Slot punching (routing)
0,80mm
ETCH RESIST
fine
mass production
Min Track
0,20mm
0,30mm
Track to Track
0,20mm
0,30mm
Track to Pad
0,35mm
0,40mm
Drill to Pad
0,30mm
0,40mm
Min Pad
0,20mm
0,30mm
Cu to Border (V-Cut)
0,30mm
0,30mm
Cu to Border (routing)
0,20mm
0,20mm
SOLDER MASK
UV green, white, black, ...
Min Pad to Mask 0,15mm
Legend print
UV black, white, …
min line 0,15mm
Electrical test
Bed of nails (grid 2.54)
Special ink
Peelable mask
Pad to Solder Mask (solder mask offset)
0,15mm
Pad to Pad (with solder mask between)
0,50mm
FINAL COATING
HAL Lead freee
Organic Solder Passivation
Standard process can be customized to customer requests or tehnological limitations