IMS printed circuit boards with metal core
MATERIAL TYPE
THERMAL CONDUCTIVITY
IMS Insulated Metal Core Al
2W/mK
5W/mK
Thermal CEM3
1W/mK
Thermal FR4
1W/mK
Cu thicknes
35 Micron (standard) 70micron
possible double side
Dielectric thicknes
75micron to 150micron 100 micron(standard)
CNC MACHINING
Drilling
min hole 1,0mm
Routing
min routing slot 1,2mm
V-cut
max material thickness 3,50mm, min core 0,3mm (Standard)
MASS PRODUCTION
Punching
Push out
min hole 1,0mm
0,9mm
Min Slot punching
1,0mm
ETCH RESIST
fine
mass production
Min Track
0,20mm
0,30mm
Track to Track
0,20mm
0,30mm
Track to Pad
0,35mm
0,40mm
Drill to Pad
0,30mm
0,40mm
Min Pad
0,20mm
0,30mm
Cu to Border (V-Cut)
0,30mm
0,30mm
Cu to Border (routing)
0,20mm
0,20mm
SOLDER MASK
UV green, white, black, ...
Min Pad to Mask 0,15mm
Legend print
UV black, white, …
min line 0,15mm
Electrical test
Bed of nails (grid 2.54)
Special ink
Peelable mask
Pad to Solder Mask (solder mask offset)
0,15mm
Pad to Pad (with solder mask between)
0,50mm
FINAL COATING
HAL Lead freee
Organic Solder Passivation
Standard process can be customized to customer requests or tehnological limitations